电路 的英文翻译

circuit

circuitry

electrocircuit

电路 的中文句子和英文句子

断续器一种阶段性的能自动打开及关闭电路并产生脉冲的仪器

A device that periodically and automatically opens and closes an electric circuit, producing pulses.


执行“蕴含”布尔操作的一种（逻辑）门电路。

A gate that performs the Boolean operation of implication.


在电话技术中，利用音调在电路中传送监控、地址和报警信号的做法。

In telephony, the use of tones to transmit supervisory, address and alerting signals over a circuit.


韦伯磁通量的国际单位，等于当磁通量在一秒钟内被统一地减弱为零时在它联接的一圈电路内产生一伏特电动势时的磁通量

The SI unit of magnetic flux equal to the magnetic flux that in linking a circuit of one turn produces in it an electromotive force of one volt as it is uniformly reduced to zero within one second.


一种接口部件或电路，用来把数据转换成某种特殊的外围设备上的表示或某类外围设备上的表示或把此种表示转换成数据。例如，一台在串行位和并行位之间作转换且解决传输速度差别的设备。

An interface unit or circuitry that converts data to and from the representation used by a particular peripheral device or class of peripheral devices; for example, a device that converts between bit serial and bit parallel and resolves differences in transmission speeds.


碰撞，匝链电路中由于磁通量而造成电伏减少的单位，等于穿过一载流线圈的磁通量与线圈匝数之积

A measure of the induced voltage in a circuit caused by a magnetic flux and equal to the flux times the number of turns in the coil that surrounds it.


用来修饰说明某种存储媒体，可以将其存储的数据除去，以便存储新的数据。例如磁带是可擦除的，纸带是不可擦除的。该术语也用于可重新编程的只读存储器（集成电路）。

A term applied to a storage medium that permits data to be removed, leaving the medium in a condition to receive new data. Magnetic tape, for example, is "erasable" and paper tape is not. The term is also applied to a read-only memory(integrated circuit) that can be reprogrammed by the user.


一种实现逻辑“或”算法的门电路或机械器件。当在其多通道输入端有一个或多个输入时就产生一个输出信号。“或”门实现逻辑“或操作”的功能。同ORelement。

An electrical gate or mechanical device which implements the logical OR operator. An output signal occurs whenever there are one or more inputs on a multichannel input. An OR gate performs the function of the logical "inclusive OR operation".


一种微电子电路器件，其中的无源元件及内部金属连线直接在绝缘衬底上形成，然后再加上有源半导体器件（通常以大圆片形式给出）。

Microelectronic circuits in which the passive components and their metallic interconnections are formed directly on an insulating substrate and the active semiconductor devices(usually in wafer form) are added subsequently.


减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。

The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.